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Industry Publications
ACMA 2012 Presentation MFA Styrene Replacement Chemistry (.pdf, 2431K)
Paper given by Dixie Chemical Corp. in partnership with SMCC and MCA
2006 Symposium on Polymers (.ppt, 3764K)
Characterizing Molded Package Stress Utilizing Tensile Displacement Measurements by A. Schoenberg
ECTC Symposium 2005 (.pdf, 226K)
Characterization and Modeling of Solubility and Diffusivity after JEDEC Prescribed Baked Conditioning Vs. Vacuum Desiccation for Mold Compounds, by A. Schoenberg
NATAS Symposia 2004 (.pdf, 434K)
New Elevated Temperature Mold Compound Adhesion Test Method Utilizing Dynamic Mechanical Analysis, by A. Schoenberg
IEEE 2008 (.pdf, 1079K)
A Methodology for Improving Granularity of Wafer Strength Testing to Characterize and Qualify a 150 Micron DFM Wafer Thinning Process, by J. Kingsbury and A.Schoenberg
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